- MediaTek Dimensity 1050 is the company’s first mmWave-capable processor and will be available from Q3 2022.
- The chipset is built on TSMC’s 6nm production process.
- MediaTek has also announced the Dimensity 930 and Helio G99 chipset.
Popular chipmaker MediaTek today has announced the Dimensity 1050 system-on-chip, which is its first mmWave 5G chipset that will power the next generation of 5G smartphones. The company says that through dual connectivity using mmWave and sub-6GHz, the Dimensity 1050 will deliver incredible speeds. The chipset can migrate between network bands and is built on the ultra-efficient TSMC 6nm production process with an octa-core CPU. it supports 3CC carrier aggregation on the sub-6 (FR1) spectrum and 4CC carrier aggregation on the mmWave (FR2) spectrum.
The chipset is capable of delivering up to 53 percent faster speeds and greater reach compared to LTE + mmWave aggregation alone. Additionally, MediaTek has also announced the Dimensity 930 chipset and Helio G99 gaming-oriented chipsets alongside.
MediaTek Dimensity 1050 specifications
The MediaTek Dimensity 1050 chipset has been announced. The SoC integrates two premium ARM Cortex-A78 CPUs with up to 2.5GHz speeds and the latest ARM Mali-G610 graphics engine.
“The Dimensity 1050, and its combination of sub-6GHz and mmWave technologies, will deliver end-to-end 5G experiences, uninterrupted connectivity and superior power efficiency to meet everyday user demands. With faster, more reliable connections, and advanced camera technology this chip delivers powerful features to help device makers differentiate their smartphone product lines,” said CH Chen, Deputy General Manager of the Wireless Communications Business Unit at MediaTek.
The Dimensity 1050 also offers Wi-Fi optimisations alongside MediaTek’s HyperEngine 5.0 gaming technology to ensure lower-latency connections with the new tri-band – 2.4GHz, 5GHz and 6GHz. The chipset supports UFS 3.1 storage, LPDDR5 memory for ultra-fast data streams, Wi-Fi 6E, 2X2 MIMO antenna, and a 144Hz FHD+ display with vibrant colours through MediaTek’s MiraVision 760.
The chipset supports a dual HDR video capture engine that will enable users to simultaneously stream with the front and rear cameras. There’s noise reduction for low-light photos and MediaTek’s APU 550 is claimed to improve AI camera actions.
MediaTek Dimensity 930 and Helio G99 specifications
MediaTek has also announced the Dimensity 930 and Helio G99 chipset. The former is a 5G-enabled chipset and is claimed to offer faster download speeds with 2CC-CA, including mixed duplex FDD+TDD for higher speeds and greater reach. There’s support for MiraVision HDR video playback, a 120Hz Full HD+ displays and HDR10+ video.
The HyperEngine 3.0 Lite gaming enhancements will bring intelligent multi-network management to ensure lower latency for smooth user experiences and maximised battery life. Phones powered with the Dimensity 930 will be available in the second quarter of 2022.
On the other hand, the Helio G99 is aimed at budget 4G phones. It is claimed to offer higher throughput rates and better power efficiency compared to the Helio G96 SoC. Phones with the Helio G99 and Dimensity 1050 will be available from Q3 2022.
