The unveiling of the MediaTek Dimensity 810 chipset has made one thing very clear – mainstream smartphones are all set to receive newer flagship-grade specs. It is the first in the Dimensity 800 series to have been built with the 6nm process. Support for dual SIM 5G is onboard this SoC, aside from a series of other traits that will give manufacturers immense scope for dishing out stellar user experiences. Now that MediaTek has confirmed that realme will be the first smartphone vendor to launch world’s first-ever MediaTek Dimensity 810 powered smartphone, here, we will give you the lowdown on what you can expect from this processor.
When it comes to offering top-notch performance, MediaTek Dimensity chipsets seldom disappoint. So it’s no surprise that the MediaTek Dimensity 810 also has impressive hardware at its core. We’re talking, an octa-core processor bearing two ARM Cortex-A76 cores clocked at up to 2.4GHz and six ARM Cortex-A55 cores clocked at up to 2GHz. And this hardware is complemented by an ARM Mali-G57 MC2 GPU for super-smooth graphical performance. It should enable any phone running the MediaTek Dimensity 810 chipset to deliver stellar gaming experiences even with demanding games.
This high-end setup will contribute to a rich user experience by offering lag-free interfaces, snappier app responses, and smooth multi-tasking. The 6nm building process of this SoC allows it to deliver this rich performance while being incredibly power efficient. Ultimately, the Dimensity 810 empowers phone makers like realme to make some of the slimmest and lightest 5G smartphones that bring powerful performance and excellent battery life. This chipset’s adoption of the LPDDR4x memory, premium UFS storage, and the MediaTek HyperEngine 2.0 gaming technology are a few more aspects that contribute to its speedy nature.
Super-fast connectivity with dual SIM 5G
The MediaTek Dimensity 810 doesn’t just integrate a 5G modem, but it also enhances it with technologies that make sure that phones will face no issues while connecting to the super-fast wireless standard. Firstly, there’s 2CC Carrier Aggregation onboard, allowing the 5G modem to cover a wide spectrum. It means devices will be able to offer higher average speeds as well as uninterrupted handovers between two 5G connection areas. Plus, this chipset’s Mixed Duplex (FDD + TDD) 5G Carrier Aggregation brings with it greater speed, coverage, and connection reliability.
Battery consumption is something manufacturers have to look into when it comes to 5G connections, but the MediaTek Dimensity 810 has taken care of that department as well. The MediaTek 5G UltraSave power-saving enhancements onboard the chipset ensure that there is optimal power consumption across the board. That means the upcoming realme 5G phone along with other phones powered by the MediaTek Dimensity 810 processor, will have good battery life despite offering 5G connectivity. Lastly, the dual SIM 5G nature of this SoC also allows access to the latest premium VoNR services.
Slick 120Hz displays
120Hz displays are no longer the domain of premium flagship smartphones. Thanks to chipsets like the MediaTek Dimensity 810, manufacturers can bring the feature to more competitively priced phones and deliver a splendid user experience with smooth scrolling and augmented gaming visuals. Games that support high refresh rate displays can completely eliminate motion blur, which makes a huge difference to their visuals. Thanks to this chipset’s support for 120Hz displays with FHD+ resolution, such panels are all set to become more common in mainstream phones.
MediaTek HyperEngine 2.0 technology
Over the years, the MediaTek HyperEngine technology has evolved into an incredibly powerful suite of features that work behind the scenes to ensure seamless gaming. MediaTek HyperEngine 2.0 does that with intelligent and dynamic management of the CPU, GPU, and memory. This kind of optimisation manages to dish out enough power for gaming, thus ensuring that there are no lags or stutters. A 4G/5G Smart Switch feature ensures smooth transitions between these connectivity standards in case you’re travelling while playing your games. Other features of the MediaTek HyperEngine 2.0 include intelligent prediction of Wi-Fi and 5G concurrency and call and data concurrency on 5G.
AI-based photography treats
The MediaTek Dimensity 810 chipset supports 64MP cameras and comes with its very own facial recognition engine. Thanks to the presence of MFNR and MCTF technologies, cameras utilizing this chip’s ISP will be able to offer advanced noise reduction in nighttime and low-light scenarios. Plus, its support for hardware acceleration on dual cameras setups means enhanced bokeh effects for portraits. The MediaTek Dimensity 810 also wants to make it easier for phone makers to dish out AI-based photography features. Working with Arcsoft, the company has created its AI-Color technology that turns everything but the subject black-and-white. AI-Bokeh is also onboard, offering manufacturers the ability to deliver portrait features even with a single camera.
The MediaTek Dimensity 810 chipset has been designed with intense attention to detail in terms of market needs. It brings powerful performance, 5G connectivity, incredible camera features, and more to empower smartphone vendors to produce some of the most advanced and future-ready smartphones. As we mentioned, MediaTek has collaborated with realme to showcase the prowess of the new MediaTek Dimensity 810 chipset. realme’s new 5G smartphone will be the world’s first-ever smartphone to be powered by the MediaTek Dimensity 810 processor. So, keep an eye out for the new realme 5G smartphone and grab it at launch to enjoy all the benefits of the new MediaTek Dimensity 810 chipset.