Another interesting aspect of the Xiaomi Mi 11 is that the back panel is free from any critical components. In contrast, other OEMs usually use it to house the wireless charging coils. Instead, it latches on to the motherboard via a separate element that can be detached. Xiaomi has also used the back panel to house thermally conductive elements that help transfer heat from the phone components.
Also read: Mi 11 Pro launch reportedly in February 2021
Given that the Xiaomi Mi 11 Pro runs a beefy Qualcomm Snapdragon 888 SoC, it stands to reason that the smartphone will come with adequate cooling. The teardown revealed that the SoC is enveloped by copious amounts of copper that take away the excess heat when under load. Its 4,600mAh battery is fairly easy to remove too thanks to two pull tabs that easily pry it off the motherboard.