“The Xiaomi Mi 9 is expected to come with a triple camera module with the main camera being a 48-megapixel Sony IMX586 sensor“
We have already witnessed the launch of first smartphone with Snapdragon 8150 in the form of Royole FlexPai. Now, if the reports are to be believed, the Xiaomi Mi 9 could be the first-ever mainstream smartphone to be powered by the upcoming flagship processor. The Snapdragon 8150 is yet to be announced by Qualcomm and very little is known about the same.
Xiaomi Mi 9 specifications, features
According to the latest report, Xiaomi Mi 9 is rumoured to be powered by the upcoming Snapdragon 8150 SoC and is scheduled to launch in the first half of 2019. The rumours also have it that the smartphone is likely to be launched in three RAM variants – 6GB, 8GB and 10GB. Further, the Xiaomi Mi 9 is tipped to come with a triple camera module on the rear panel, a first for Xiaomi. And if the report is to be believed, the primary sensor on the module will be a whopping 48-megapixel Sony IMX586 sensor. Other rumoured details include an under-display fingerprint scanner and wireless charging.
Unfortunately, nothing else is known about the upcoming flagship smartphone at the moment.
Qualcomm Snapdragon 8150 features, details
According to previous reports, the Snapdragon 8150 will be manufactured by TSMC using a 7-nanometer process, which is a first for Qualcomm. Rumours also have it that the chipset will come with a dedicated neural processor for AI, and according to popular leakster, Roland Quandt the architecture is very much similar to Huawei’s Hisilicon Kirin 980 SoC. According to the report, the SoC will be a tri-cluster setup with two dual cores and a quad-core chip, instead of the usual pair of quad-core clusters. In this setup, two cores are used for burst performance, two for sustained speed and four little cores for handling lighter tasks.
We will know more about the Xiaomi Mi 9 and Qualcomm’s latest and greatest in the coming days. Stay tuned to 91mobiles to get all the updates in time.