Xiaomi Xring 03

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Xiaomi Xring 03 is a Flagship 10 core chipset launched in August, 2026, manufactured using a 3 nm process technology. Xiaomi Xring 03 has 2 cores C1 Ultra at 4.35 GHz, 4 cores C1 Premium at 3.68 GHz, and 4 cores C1 Pro at 3.15 GHz.

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Key Specs

  • CPU: Deca Core (4.35 GHz, Dual Core + 3.68 GHz, Quad core + 3.15 GHz, Quad core)
  • Process Node: 3 nm
  • GPU: Mali-G2 Ultra NX MP16, 1.6 GHz
  • Memory Type: LPDDR6
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Xiaomi Xring 03 Specifications

General CPU GPU Memory Camera Multimedia Connectivity

General

SoC Brand Xiaomi
Title Xiaomi Xring 03
Manufacturing TSMC

CPU

Total Cores Deca Core
CPU Deca Core (4.35 GHz, Dual Core, C1 Ultra + 3.68 GHz, Quad core, C1 Premium + 3.15 GHz, Quad core, C1 Pro)
Architecture 64 bit
Process Node 3 nm
Instruction Set ARMv9.3-A
L2 Cache 12 MB
L3 Cache 16 MB

GPU

GPU Mali-G2 Ultra NX MP16
GPU Clock speed 1.6 GHz
Pipelines 16
Shading Units 128
Total Shaders 2048
FLOPS 6554 Gigaflops
Vulkan Version 1.4
OpenCL Version 3.0 FP

Memory

Memory Type LPDDR6
Memory Speed 5.333 GHz
Bus 4x24 Bit
Memory Max bandwidth 120 Gb/s
Memory Max size 24 GB
Storage Type UFS 4.1

Camera

Max Video Capture Resolution 8K @ 30 FPS

Multimedia

Video Playback Resolution 8K @ 30 FPS
Video Codecs H.264, H.265, AV1, VP9
Audio Codecs AAC-LC, MP3, HE-AACv1, HE-AACv2, FLAC

Connectivity

5G Support Yes
Wi-Fi Version 7
Wi-Fi Standard a, ac, ax, be, e, g, n, n 5GHz
Bluetooth Version 6.0
Navigation BeiDou, Galileo, Glonass, GPS, QZSS