Qualcomm Snapdragon 875 specifications leaked: X60 5G modem, Adreno 660 GPU, and more

Here's a look at the key features and specifications of Snapdragon 875:

• Kryo 685 CPU built on Arm v8 Cortex tech
• 3G/ 4G/ 5G modem –Millimeter wave (mmWave) and sub-6 GHz bands
• Adreno 660 GPU
• Adreno 665 VPU
• Adreno 1095 DPU
• Qualcomm Secure Processing Unit (SPU250)
• Spectra 580 image-processing engine
• Snapdragon Sensors Core Technology
• External 802.11ax, 2×2 MIMO, and Bluetooth Milan
• Compute Hexagon DSP with Hexagon Vector eXtensions and Hexagon Tensor Accelerator
• Quad-channel package-on-package (PoP) high-speed LPDDR5 SDRAM
• Low-power audio subsystem combined with Aqstic Audio Technologies WCD9380 and WCD9385 audio codec

The Snapdragon 875 specifications tipped to us reveal some of the upgrades we can expect to see, but there is no information yet on what kind of performance improvements we can see. The chipset will be made using the 5nm process, which is the smallest yet, so it should bring significant performance and graphics improvements as well as greater energy efficiency over the Snapdragon 865.

As for the launch, Snapdragon 875 will launch in December if Qualcomm is able to maintain its annual unveiling schedule at its year-end conference. However, with coronavirus wreaking havoc, the launch may be pushed to early 2021, though it is too early to tell at the moment. There is little other information about the chipset at the moment, except that it reportedly will be manufactured by Taiwan's TSMC.